High voltage cascoded III-nitride rectifier package with etched leadframe

ABSTRACT

Some exemplary embodiments of high voltage cascaded III-nitride semiconductor package with an etched leadframe have been disclosed. One exemplary embodiment comprises a III-nitride transistor having an anode of a diode stacked over a source of the III-nitride transistor, and a leadframe that is etched to form a first leadframe paddle portion coupled to a gate of the III-nitride transistor and the anode of the diode, and a second leadframe paddle portion coupled to a drain of the III-nitride transistor. The leadframe paddle portions enable the package to be surface mountable. In this manner, reduced package footprint, improved surge current capability, and higher performance may be achieved compared to conventional wire bonded packages. Furthermore, since multiple packages may be assembled at a time, high integration and cost savings may be achieved compared to conventional methods requiring individual package processing and externally sourced parts.

The present application claims the benefit of and priority to a provisional application entitled “High Voltage Cascaded GaN Rectifier Leadless Packages,” Ser. No. 61/482,314 filed on May 4, 2011. The disclosure in that provisional application is hereby incorporated fully by reference into the present application.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates generally to semiconductor devices. More particularly, the present invention relates to packaging of semiconductor devices.

2. Background Art

For high power and high performance circuit applications, III-nitride transistors such as gallium nitride (GaN) field effect transistors (FETs) are often desirable for their high efficiency and high voltage operation. In particular, it is often desirable to combine such III-nitride transistors with other devices, such as silicon diodes, to create high performance rectifiers such as cascaded rectifiers.

Unfortunately, conventional package integration techniques for combining III-nitride transistors with silicon diodes often negate the benefits provided by such III-nitride transistors. For example, conventional package designs may require wire bonds to leads for terminal connections, undesirably increasing package form factor, manufacturing costs, parasitic inductance, resistance, and thermal dissipation requirements of the package. While it is known to use conductive clips instead of wire bonds to provide a high performance package terminal suitable for high voltage applications, the requirement to separately form and place the conductive clips precludes the possibility of processing multiple packages in a single pass, which is highly desirable for streamlining assembly, increasing integration, and reducing fabrication costs.

Thus, a unique and cost-effective solution is needed to support the efficient fabrication of packages integrating high voltage cascoded III-nitride rectifiers.

SUMMARY OF THE INVENTION

A high voltage cascoded III-nitride rectifier package with a etched leadframe, substantially as shown in and/or described in connection with at least one of the figures, and as set forth more completely in the claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a circuit diagram of a III-nitride transistor coupled with a Group IV diode.

FIG. 2A illustrates a front side of a group IV diode.

FIG. 2B illustrates a backside of a group IV diode.

FIG. 2C illustrates a front side of a III-nitride transistor.

FIG. 2D illustrates a backside of a III-nitride transistor.

FIG. 2E illustrates a top view of a high voltage cascoded III-nitride rectifier package assembly, according to an embodiment of the invention.

FIG. 2F illustrates a cross sectional view of a high voltage cascoded III-nitride rectifier package assembly, according to an embodiment of the invention.

FIG. 2G illustrates a top view of a high voltage cascoded III-nitride rectifier package assembly, according to an embodiment of the invention.

FIG. 2H illustrates a cross sectional view of a high voltage cascaded III-nitride rectifier package assembly, according to an embodiment of the invention.

FIG. 2I illustrates a cross sectional view of a high voltage cascoded III-nitride rectifier package assembly, according to an embodiment of the invention.

FIG. 2J illustrates a top view of a high voltage cascoded III-nitride rectifier package assembly, according to an embodiment of the invention.

FIG. 2K illustrates a cross sectional view of a high voltage cascoded III-nitride rectifier package assembly, according to an embodiment of the invention.

FIG. 2L illustrates a bottom view of a high voltage cascaded III-nitride rectifier package assembly, according to an embodiment of the invention.

FIG. 2M illustrates a cross sectional view of a high voltage cascoded III-nitride rectifier package assembly, according to an embodiment of the invention.

FIG. 3 illustrates a cross sectional view of a high voltage cascoded III-nitride rectifier package, according to an embodiment of the invention.

FIG. 4 illustrates a cross sectional view of a high voltage cascoded III-nitride rectifier package, according to another embodiment of the invention.

DETAILED DESCRIPTION OF THE INVENTION

The present application is directed to a high voltage cascoded III-nitride rectifier package with an etched leadframe. The following description contains specific information pertaining to the implementation of the present invention. One skilled in the art will recognize that the present invention may be implemented in a manner different from that specifically discussed in the present application. Moreover, some of the specific details of the invention are not discussed in order not to obscure the invention. The specific details not described in the present application are within the knowledge of a person of ordinary skill in the art.

The drawings in the present application and their accompanying detailed description are directed to merely exemplary embodiments of the invention. To maintain brevity, other embodiments of the invention, which use the principles of the present invention, are not specifically described in the present application and are not specifically illustrated by the present drawings.

As used herein, the phrase “III-Nitride or III-N” refers to a compound semiconductor that includes nitrogen and at least one group three element including Al, Ga, In and B, and including but not limited to any of its alloys, such as aluminum gallium nitride (AlxGa(1-x)N), indium gallium nitride (InyGa(1-y)N), aluminum indium gallium nitride (AlxInyGa(1-x-y)N), gallium arsenide phosphide nitride (GaAsaPb N(1-a-b)), aluminum indium gallium arsenide phosphide nitride (AlxInyGa(1-x-y)AsaPb N(1-a-b)), amongst others. III-nitride material also refers generally to any polarity including but not limited to Ga-polar, N-polar, semi-polar or non-polar crystal orientations. The III-Nitride material also includes either the Wurtzitic, Zincblende or mixed polytypes, and includes single-crystal, monocrystal, polycrystal or amorphous crystal structures.

Also as used herein, the phrase “Group IV” refers to a semiconductor that includes at least one group four element including Si, Ge and C, and also includes compound semiconductors SiGe and SiC amongst others. Group IV also refers to semiconductor material which consists of layers of Group IV elements or doping of group IV elements to produce strained silicon or strained Group IV material, and also includes Group IV based composite substrates including SOI, SIMOX and SOS (silicon on sapphire), amongst others.

U.S. patent application titled “III-Nitride Transistor Stacked with Diode in a Package,” Ser. No. 13/053,646 filed on Mar. 22, 2011, whose disclosure is hereby incorporated fully by reference into the present application, teaches a two-terminal stacked-die package including a diode, such as a silicon diode, stacked atop a III-nitride transistor, such that a cathode of the diode resides on and is electrically coupled to a source of the III-nitride transistor. A first terminal of the package is coupled to a drain of the III-nitride transistor, and a second terminal of the package is coupled to an anode of the diode.

The present application addresses and discloses modifications needed to form a wire-bondless surface mountable high voltage semiconductor package for use in high voltage (200V-1200V or higher) applications. Additionally, the present application addresses and discloses the construction of such a package by describing the use of an etched leadframe for mechanical support and to enable surface mounting, which is also known as a high density assembly (HDA) package.

The present application describes the physical arrangement of a stacked-die wire-bondless surface mountable high voltage package. In particular, a Group IV diode is stacked atop a III-N material transistor in a quad flat no-lead (QFN) package. Modifications required to accommodate the high voltage field differential between the anode and cathode of the device (>200V) include widening the physical separation between the anode and cathode to, for example, 2.7500 mm or greater.

FIG. 1 illustrates a circuit diagram of a III-nitride transistor coupled with a Group IV diode, such as a silicon diode. In the present application, references to a “silicon diode” are made for brevity and convenience only. However, the “Group IV or silicon diode” in the context of the present invention's stacked-die package can be replaced with a non-silicon diode or in general with any diode. FIG. 1 includes terminals 112 a and 112 b, nodes 114 and 116, diode 120, and III-nitride transistor 130. III-nitride transistor 130 may, for example, comprise a gallium nitride (GaN) field effect transistor (FET), or a GaN high electron mobility transistor (HEMT), and may more specifically comprise a depletion-mode GaN transistor. Diode 120 can be either a PN junction diode or a Schottky diode.

In the example shown in FIG. 1, the cathode 121 of diode 120 is coupled to the source 133 of III-nitride transistor 130 at node 114. Additionally, a complete cascoded switch is formed by coupling the gate 131 of III-nitride transistor 130 to the anode 122 of diode 120 at node 116. Thus, the circuit of FIG. 1 implements a high performance cascoded rectifier. However, in alternative embodiments, the circuit may comprise a different configuration of diode 120 with III-nitride transistor 130.

It may be preferable to form the III-Nitride FET or III-Nitride HEMT as discussed in U.S. Pat. No. 7,745,849 issued on Jun. 29, 2010 titled “Enhancement Mode III-Nitride Semiconductor Device with Reduced Electric Field Between the Gate and the Drain,” U.S. Pat. No. 7,759,699 issued on Jul. 20, 2010 titled “III-Nitride Enhancement Mode Devices,” U.S. Pat. No. 7,382,001 issued on Jun. 3, 2008 titled “Enhancement Mode III-Nitride FET,” U.S. Pat. No. 7,112,830 issued on Sep. 26, 2006 titled “Super Lattice Modification of Overlying Transistor,” U.S. Pat. No. 7,456,442 issued on Nov. 25, 2008 titled “Super Lattice Modification of Overlying Transistor,” U.S. Pat. No. 7,339,205 issued on Mar. 4, 2008 titled “Gallium Nitride Materials and Methods Associated with the Same,” U.S. Pat. No. 6,849,882 issued on Feb. 1, 2005 titled “Group-III Nitride Based High Electron Mobility Transistor (HEMT) with Barrier/Spacer Layer,” U.S. Pat. No. 6,617,060 issued on Sep. 9, 2003 titled “Gallium Nitride Materials and Methods,” U.S. Pat. No. 6,649,287 issued on Nov. 18, 2003 titled “Gallium Nitride Materials and Methods,” U.S. Pat. No. 5,192,987 issued on Mar. 9, 1993 titled “High Electron Mobility Transistor with GAN/ALXGAl—XN Heterojunctions,” and U.S. patent application titled “Group III-V Semiconductor Device with Strain-Relieving Interlayers,” Ser. No. 12/587,964 filed on Oct. 14, 2009, U.S. patent application titled “Stress Modulated Group III-V Semiconductor Device and Related Method,” Ser. No. 12/928,946 filed on Dec. 21, 2010, U.S. patent application titled “Process for Manufacture of Super Lattice Using Alternating High and Low Temperature Layers to Block Parasitic Current Path,” Ser. No. 11/531,508 filed on Sep. 13, 2006, U.S. patent application titled “Programmable III-Nitride Transistor with Aluminum-Doped Gate,” Ser. No. 13/021,437 filed on Feb. 4, 2011, U.S. patent application titled “Enhancement Mode III-Nitride Transistors with Single Gate Dielectric Structure,” Ser. No. 13/017,970 filed on Jan. 31, 2011, U.S. patent application titled “Gated AlGaN/GaN Heterojunction Schottky Device,” Ser. No. 12/653,097 filed on Dec. 7, 2009, U.S. patent application titled “Enhancement Mode III-Nitride Device with Floating Gate and Process for Its Manufacture,” Ser. No. 12/195,801 filed on Aug. 21, 2008, U.S. patent application titled “III-Nitride Semiconductor Device with Reduced Electric Field Between Gate and Drain and Process for Its Manufacture,” Ser. No. 12/211,120 filed on Sep. 16, 2008, U.S. patent application titled “III-Nitride Power Semiconductor Device Having a Programmable Gate,” Ser. No. 11/857,113 filed on Sep. 8, 2007, U.S. provisional patent application titled “III-Nitride Heterojunction Devices, HEMTs and Related Device Structures,” Ser. No. 61/447,479 filed on Feb. 28, 2011, and U.S. provisional patent application titled “III-Nitride Material Interlayer Structures,” Ser. No. 61/449,046 filed on Mar. 3, 2011, which are all hereby incorporated fully into the present application by reference. It may also be desirable that the III-Nitride FET be a high voltage III-N FET. III-N PET 130 may be optimized to operate with a V_(drain) of between 200V-5000V, or it may be preferred that FET 130 be optimized to operate between 500V-700V or any other sub range between 200V-5000V.

Turning to FIGS. 2A-2D, FIG. 2A illustrates a front side of a group IV diode, FIG. 2B illustrates a backside of a group IV diode, FIG. 2C illustrates a front side of a III-nitride transistor, and FIG. 2D illustrates a backside of a III-nitride transistor. With respect to FIGS. 2A-2D, diode 220 may correspond to diode 120 from FIG. 1, and III-nitride transistor 230 may correspond to III-nitride transistor 130 from FIG. 1. In certain embodiments, a die size of approximately 1 mm×1 mm may be preferred for diode 220. In certain other embodiments, the die size of diode 220 may be larger or smaller. As shown in FIGS. 2A and 2B, the silicon diode 220 includes an anode 222 on a top surface and a cathode 212 on an opposite bottom surface. As shown in FIGS. 2C and 2D, the III-nitride transistor 230 includes a gate 231, a drain 232, and a source 233 on a top surface, whereas a bottom or backside surface is inactive. In certain embodiments, a die size of approximately 3.2 mm×2.795 mm may be preferred for III-nitride transistor 230. In certain other embodiments, the die size of III-nitride transistor 230 may be larger or smaller.

Next, FIGS. 2E, 2G, and 2J illustrate top views of a high voltage cascoded III-nitride rectifier package assembly, according to an embodiment of the invention. FIGS. 2F, 2H, 2I, 2K, and 2M also illustrate corresponding cross sectional views of a high voltage cascoded III-nitride rectifier package assembly, according to an embodiment of the invention. FIG. 2L also illustrates a bottom view of a completed high voltage cascoded III-nitride rectifier package assembly, according to an embodiment of the invention.

Starting with FIG. 2E, portions of leadframe 212 may be front etched to provide a space to receive diode 220. Leadframe 212 may comprise, for example, a copper or copper alloy leadframe, and may have a thickness of approximately 0.4000 mm. The front etching may also leave a pedestal 213 for future connection to gate 231 of III-nitride transistor 230, as discussed in conjunction with FIG. 2I below. Anode 222 of diode 220 may be mounted on leadframe 212 as shown, such that the cathode 221 of diode 220 is accessible on a top surface thereof. Prior to such mounting, solder, such as a solder paste or a solder pre-form, may be applied to leadframe 212. Alternatively, other materials such as conductive adhesive or conductive tape may substitute for solder. FIG. 2F illustrates a cross sectional view corresponding to line 2F-2F in FIG. 2E, showing that the top surfaces of diode 220 and leadframe 212 are substantially coplanar.

For simplicity, the Figures may only illustrate the assembly of a single package. However, it is understood that leadframe 212 may extend beyond the single package portion shown in the Figures. Thus, leadframe 212 may provide for the assembly and processing of multiple packages at once, for example in a strip or grid.

From FIG. 2E to FIG. 2G, III-nitride transistor 230 is placed on top of leadframe 212 and on top of diode 220. The backside 240 of III-nitride transistor 230 is therefore visible from the top view of FIG. 2G. As shown in FIG. 2H illustrating a cross sectional view corresponding to line 2H-2H in FIG. 2G, III-nitride transistor 230 rests directly on and is mechanically supported by leadframe 212 and diode 220. More specifically, drain 232 of III-nitride transistor 230 is connected to leadframe 232, and source 233 of III-nitride transistor 230 is electrically and mechanically coupled to cathode 221 of diode 220. Observing FIG. 2H in a vertically flipped orientation, it can also be described that cathode 221 of diode 220 is directly stacked on top of source 233 of III-nitride transistor 230.

FIG. 2I also illustrates a cross sectional view corresponding to line 2I-2I in FIG. 2G. As shown in FIG. 2I, the gate 231 of III-nitride transistor 230 may be connected to leadframe 212 by pedestal 213. Pedestal 213 may be sized smaller or larger than gate 231, depending on application requirements for thermal dissipation or electrical isolation. For example, a smaller pedestal 213 may provide for a surrounding solder resist pattern for greater electrical isolation, whereas a larger pedestal 213 may provide for greater thermal dissipation with less electrical isolation due to the lack of a solder resist pattern.

Prior to the placement of III-nitride transistor 230, solder or other conductive materials may be applied to leadframe 212 and to diode 220 for attachment to gate 231, source 233, and drain 232 of III-nitride transistor 230. After the placement of III-nitride transistor 230, the entire leadframe assembly may be heated, for example in a reflow or conveyor oven, to reflow the previously deposited solder.

From FIG. 2G to FIG. 2J, a mold compound 250 may be applied, encapsulating the entire package and covering the top surface. FIG. 2K also illustrates a cross sectional view corresponding to line 2K-2K in FIG. 2J. In alternative embodiments, mold compound 250 may expose backside 240 of III-nitride transistor 230, as discussed in conjunction with FIG. 3 below. Mold compound 250 may comprise, for example, a plastic epoxy molding compound, which may be applied using an Air-Cavity design or a Plastic-Molded design, amongst others.

After applying mold compound 250, leadframe 212 may be back etched, and the etched portions of leadframe 212 may be replaced by filling with an insulating material 252, which may comprise a material similar to mold compound 250. Thus, all the components of package 210, including III-nitride transistor 230, diode 220, and leadframe paddle portions 212 a and 212 b may remain encapsulated by mold compound 250 and insulating material 252. As shown by FIG. 2M illustrating a cross sectional view corresponding to line 2M-2M in FIG. 2L, two separate leadframe paddle portions may thus be created from leadframe 212, including a first leadframe paddle portion 212 b and a second leadframe paddle portion 212 a. Further, as shown by the bottom view of FIG. 2L, leadframe paddle portions 212 a and 212 b may expose surfaces to enable surface mounting, and may be separated by a distance of at least 2.7500 mm to enable high voltage operation at 600V. Leadframe paddle portions 212 a and 212 b may also be substantially coplanar to facilitate surface mounting.

As a result of etching leadframe 212 into leadframe paddle portions 212 a and 212 b, leadframe paddle portion 212 b may mechanically support and be connected to gate 231 of III-nitride transistor 230 and anode 222 of diode 220, and leadframe paddle portion 212 a may mechanically support and be connected to drain 232 of III-nitride transistor 230. Thus, the cascoded rectifier circuit illustrated in diagram 100 of FIG. 1 is provided, with leadframe paddle portion 212 a corresponding to terminal 112 a of FIG. 1 and leadframe paddle portion 212 b corresponding to terminal 112 b of FIG. 1.

Package 210 of FIG. 2M may then be singulated from leadframe 212, using conventional methods as known in the art. Thus, package 210 is ready for surface mounting to a support surface, such as a printed circuit board or substrate, via the surfaces exposed by leadframe paddle portions 212 a and 212 b, as shown in FIG. 2L.

Turning to FIG. 3, FIG. 3 illustrates a cross sectional view of a high voltage cascoded III-nitride rectifier package, according to another embodiment of the invention. Comparing package 310 of FIG. 3 with package 210 of FIG. 2M, it can be observed that mold compound 250 is applied such that the backside 240 of III-nitride transistor 230 is exposed through mold compound 250. Optionally, a heatsink may also be affixed to backside 240 for improved thermal dissipation.

Turning to FIG. 4, FIG. 4 illustrates a cross sectional view of a high voltage cascoded III-nitride rectifier package, according to another embodiment of the invention. Comparing package 410 of FIG. 4 with package 310 of FIG. 3, it can be observed that a thermal clip 255 is coupled to the backside 240 of III-nitride transistor 230 and is also connected to leadframe paddle portion 212 b. In alternative embodiments, thermal clip 255 may be connected to leadframe paddle portion 212 a instead of leadframe paddle portion 212 b. Thermal clip 255 may comprise any highly conductive material, for example copper, and may be attached using solder or another material prior to the application of mold compound 250. Thus, improved thermal dissipation may be provided for III-nitride transistor 230 while still encapsulating and protecting III-nitride transistor 230 with the surrounding mold compound 250. As shown in FIG. 4, the optional addition of thermal clip 255 may require a slightly larger package footprint.

Thus, a high voltage cascoded III-nitride rectifier package with an etched leadframe and methods for fabricating such a package have been described. The disclosed package provides a high voltage III-nitride cascoded rectifier in a compact package using a leadless design without wire bonds. As a result, reduced package footprint, improved surge current capability, and higher performance may be achieved compared to conventional wire bonded packages. Furthermore, since multiple packages may be assembled at a time, high integration and cost savings may be achieved compared to conventional methods requiring individual package processing and externally sourced parts.

From the above description of the invention it is manifest that various techniques can be used for implementing the concepts of the present invention without departing from its scope. Moreover, while the invention has been described with specific reference to certain embodiments, a person of ordinary skills in the art would recognize that changes can be made in form and detail without departing from the spirit and the scope of the invention. As such, the described embodiments are to be considered in all respects as illustrative and not restrictive. It should also be understood that the invention is not limited to the particular embodiments described herein, but is capable of many rearrangements, modifications, and substitutions without departing from the scope of the invention. 

The invention claimed is:
 1. A wire-bondless surface mountable high voltage semiconductor package comprising: a III-nitride transistor having a gate, a source, and a drain; a diode having an anode and a cathode, said diode stacked over said III-nitride transistor such that said cathode resides on said source and is mechanically and electrically coupled to said source; an etched leadframe comprising: a first leadframe paddle portion supporting and directly connected to said gate of said III-nitride transistor using a pedestal and supporting and directly connected to said anode of said diode; a second leadframe paddle portion supporting and connected to said drain of said III-nitride transistor; said first and second leadframe paddle portions enabling said high voltage semiconductor package to be surface mountable.
 2. The high voltage semiconductor package of claim 1, wherein said first and second leadframe paddle portions are substantially coplanar.
 3. The high voltage semiconductor package of claim 1, further comprising a mold compound encapsulating said high voltage semiconductor package including said III-nitride transistor, said diode, and said first and said second leadframe paddle portions.
 4. The high voltage semiconductor package of claim 1, further comprising a mold compound encapsulating said high voltage semiconductor package while exposing a backside of said III-nitride transistor.
 5. The high voltage semiconductor package of claim 1, further comprising a thermal clip connected to a backside of said III-nitride transistor and to said first leadframe paddle portion.
 6. The high voltage semiconductor package of claim 1, further comprising a thermal clip connected to a backside of said III-nitride transistor and to said second leadframe paddle portion.
 7. The high voltage semiconductor package of claim 1, wherein said pedestal is etched into said etched leadframe.
 8. The high voltage semiconductor package of claim 4, further comprising a heatsink affixed to said backside of said III-nitride transistor.
 9. The high voltage semiconductor package of claim 1, wherein said diode is a Schottky diode.
 10. The high voltage semiconductor package of claim 1, wherein said III-nitride transistor is a GaN FET.
 11. The high voltage semiconductor package of claim 1, wherein said III-nitride transistor is a GaN HEMT.
 12. A method for manufacturing a wire-bondless surface mountable high voltage semiconductor package, said method comprising: mounting, on an etched leadframe, a diode having a cathode and an anode; placing, over said leadframe and said diode, a III-nitride transistor having a gate, a source, and a drain, said source of said III-nitride transistor being coupled to said cathode of said diode, said cathode residing on said source; applying a mold compound to encapsulate said III-nitride transistor, said diode, and said leadframe; forming a first leadframe paddle portion supporting and directly connected to said gate of said III-nitride transistor using a pedestal and supporting and directly connected to said anode of said diode and a second leadframe paddle portion supporting and connected to said drain of said III-nitride transistor, said first and second leadframe paddle portions enabling said high voltage semiconductor package to be surface mountable.
 13. The method of claim 12, wherein said first and second leadframe paddle portions are substantially coplanar.
 14. The method of claim 12, wherein said applying said mold compound exposes a backside of said III-nitride transistor.
 15. The method of claim 12, further comprising connecting a thermal clip to a backside of said III-nitride transistor and to said first leadframe paddle portion of said leadframe.
 16. The method of claim 12, wherein said pedestal is etched into said etched leadframe.
 17. The method of claim 14, further comprising affixing a heatsink to said backside of said III-nitride transistor.
 18. The method of claim 12, wherein said diode is a Schottky diode.
 19. The method of claim 12, wherein said III-nitride transistor is a GaN FET.
 20. The method of claim 12, wherein said III-nitride transistor is a GaN HEMT. 